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| Item number:
CIEN9-19278373 Manufacturer no.:
725282-001 EAN/GTIN:
n/a |
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| Options, accessories, services and support for all your HP and Compaq products. More information: Memory | Memory channels | Dual-channel | | Maximum internal memory supported by processor | 32 GB | | Memory types supported by processor | DDR3-SDRAM | | Memory clock speeds supported by processor | 1333,1600 MHz | | ECC | Yes | Other features | Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x | Processor special features | Intel® Anti-Theft Technology (Intel® AT) | Yes | | Intel® Identity Protection Technology (Intel® IPT) | Yes | | Intel® Turbo Boost Technology | 2.0 | | Intel Fast Memory Access | Yes | | Intel Flex Memory Access | Yes | | Intel® AES New Instructions (Intel® AES-NI) | Yes | | Enhanced Intel SpeedStep Technology | Yes | | Intel Trusted Execution Technology | Yes | | Intel VT-x with Extended Page Tables (EPT) | Yes | | Intel® Secure Key | Yes | | Intel TSX-NI | Yes | | Intel Stable Image Platform Program (SIPP) | Yes | | Intel® OS Guard | Yes | | Intel Virtualization Technology (VT-x) | Yes | | Intel Virtualization Technology for Directed I/O (VT-d) | Yes | | Intel® vPro™ Platform Eligibility | Yes | Features | Execute Disable Bit | Yes | | Idle States | Yes | | Thermal Monitoring Technologies | Yes | | Market segment | Server | | PCI Express slots version | 3.0 | | PCI Express configurations | 1x16, 2x8, 1x8+2x4 | | Supported instruction sets | AVX 2.0, SSE4.1, SSE4.2 | | Scalability | 1S | | CPU configuration (max) | 1 | | Thermal solution specification | PCG 2013D | Processor | Processor family | Intel® Xeon® E3 V3 Family | | Processor cores | 4 | | Processor socket | LGA 1150 (Socket H3) | | Processor lithography | 22 nm | | Processor model | E3-1220V3 | | Processor base frequency | 3.1 GHz | | Processor operating modes | 64-bit | | Component for | Server/workstation | | Processor threads | 4 | | System bus rate | 5 GT/s | | Processor boost frequency | 3.5 GHz | | Processor cache | 8 MB | | Processor cache type | L3 | | Thermal Design Power (TDP) | 80 W | | Bus type | DMI | | Memory bandwidth supported by processor (max) | 25.6 GB/s | Weight & dimensions | Processor package size | 37.5 mm |
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