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| Item number: CIEN8-22886013 Manufacturer no.: KC.20201.DEG EAN/GTIN: n/a |
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| Cache CPU Cache is an area of fast memory located on the processor. Intel Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache. System Bus A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller. Instruction Set An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with. Lithography Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor. Thermal Solution Specification Intel Reference Heat Sink specification for proper operation of this SKU. Processor Base Frequency Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second. TDP Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements. More information: Memory | Memory channels | Dual-channel | | Maximum internal memory supported by processor | 32 GB | | Memory types supported by processor | DDR3-SDRAM | | Memory clock speeds supported by processor | 1333 MHz | | ECC | Yes | Other features | Intel® Virtualization Technology (Intel® VT) | VT-x | Processor special features | Intel® Smart Cache | Yes | | Enhanced Intel SpeedStep Technology | Yes | | Intel VT-x with Extended Page Tables (EPT) | Yes | | Intel Virtualization Technology (VT-x) | Yes | | Conflict-Free processor | Yes | Features | Execute Disable Bit | Yes | | Idle States | Yes | | Thermal Monitoring Technologies | Yes | | Market segment | Desktop | | PCI Express slots version | 2.0 | | PCI Express configurations | 1x16,2x8,1x8+2x4 | | Supported instruction sets | SSE4.1,SSE4.2 | | CPU configuration (max) | 1 | | Graphics | 22 nm | | Thermal solution specification | PCG 2011C | Processor | Processor family | Intel® Pentium® | | Processor cores | 2 | | Processor socket | LGA 1155 (Socket H2) | | Processor lithography | 22 nm | | Processor model | G2020 | | Processor base frequency | 2.9 GHz | | Processor operating modes | 64-bit | | Component for | PC | | Processor threads | 2 | | System bus rate | 5 GT/s | | Processor cache | 3 MB | | Processor cache type | L3 | | L3 cache speed | 2.9 GHz | | Thermal Design Power (TDP) | 55 W | | Bus type | DMI | | Memory bandwidth supported by processor (max) | 21 GB/s | Weight & dimensions | Processor package size | 37.5 mm | Graphics | On-board graphics card | Yes | | On-board graphics card model | Intel® HD Graphics | | On-board graphics card base frequency | 650 MHz | | On-board graphics card dynamic frequency (max) | 1050 MHz | | Number of displays supported (on-board graphics) | 3 |
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| Other search terms: Pentium, intel cpu, processor, CPU, CPUs, AMD, Intel, Dual-Core, Athlon, Quad processor, opteron, celeron, sempron, pentium, xeon, turion, pentium 4 |
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