Recommend for Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake), FCLGA4189-4/5(Socket P4/P5), Copper for both Vapor Chamber Base and Fin Stack, Passive Cooler for Blade a...
Recommend for Intel® Romley- EP / EX Platform, Sandy Bridge Processor, Socket LGA 2011 - Active Cooler by Side-Blowing Cooling for 2U Server For Narrow ILM Only
CPU Support: Intel® Sandy Bridge EP/EX Processors up to 150 Watts - Solution: 2U&Up Server - Material: H.C.C.(Heatpipes Contact CPU) Copper Base & Aluminum Fins with Heatpipes embedded
Recommend for Intel® Alder Lake S Processor, Socket LGA 1700, 60 x 60 x 25 mm Fan with PWM function, Copper Base & Aluminum Fins with Heatpipes Embedded , Active Cooler for 2U Server and Up, Suppor...
The best and convenient way to bundle cables: tame the chaos of electrifying all electronic tools and helpers. - For tidying bundles of cable and other objects - Can be cut to size - Ideal for hous...
With the tesa® On & Off Bundling Cable Manager you have a flexible and reusable cable clip to bundle and organize all your audio, video and power cables. Once you know it, you will never want to mi...